JPH0711473Y2 - 溶接ヘッドの加圧構造 - Google Patents

溶接ヘッドの加圧構造

Info

Publication number
JPH0711473Y2
JPH0711473Y2 JP1988005011U JP501188U JPH0711473Y2 JP H0711473 Y2 JPH0711473 Y2 JP H0711473Y2 JP 1988005011 U JP1988005011 U JP 1988005011U JP 501188 U JP501188 U JP 501188U JP H0711473 Y2 JPH0711473 Y2 JP H0711473Y2
Authority
JP
Japan
Prior art keywords
welding head
slider
head
substrate
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988005011U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01109388U (en]
Inventor
孝 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1988005011U priority Critical patent/JPH0711473Y2/ja
Publication of JPH01109388U publication Critical patent/JPH01109388U/ja
Application granted granted Critical
Publication of JPH0711473Y2 publication Critical patent/JPH0711473Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988005011U 1988-01-19 1988-01-19 溶接ヘッドの加圧構造 Expired - Lifetime JPH0711473Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Publications (2)

Publication Number Publication Date
JPH01109388U JPH01109388U (en]) 1989-07-24
JPH0711473Y2 true JPH0711473Y2 (ja) 1995-03-15

Family

ID=31208015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988005011U Expired - Lifetime JPH0711473Y2 (ja) 1988-01-19 1988-01-19 溶接ヘッドの加圧構造

Country Status (1)

Country Link
JP (1) JPH0711473Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151182A (en) * 1980-04-25 1981-11-24 Hitachi Ltd Welding head
NL8304167A (nl) * 1983-12-05 1985-07-01 Weld Equip Bv Laskop voor weerstandslassen.
JPS63145581U (en]) * 1987-03-18 1988-09-26

Also Published As

Publication number Publication date
JPH01109388U (en]) 1989-07-24

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